Electronic module desing to maximize volume efficiency

ABSTRACT

Compact electronic modules, which may be used with implantable microstimulators and other medical and non-medical devices, and manufacture/assembly of such modules are described. Component and circuitry designs utilize unique redistribution techniques and attachment methods. A number of component designs and packaging configurations maximize the volume efficiency of electronic modules. Also included are improved processes and systems enabling the manufacture and assembly of such compact packages.

The present application is a divisional of U.S. patent application Ser.No. 10/609,452, filed Jun. 27, 2003 and now allowed, which claims thebenefit of U.S. Provisional Patent Application Ser. No. 60/392,475,filed Jun. 28, 2002. These applications are incorporated herein byreference in their entireties.

FIELD OF THE INVENTION

The present invention generally relates to compact electronic modulesand more particularly to component and circuitry designs utilizingredistribution techniques; attachment methods, and other packaging thatmaximizes the volume efficiency of electronic modules, and furtherrelates to improved processes and systems enabling the manufacture andassembly of such compact packages.

BACKGROUND OF THE INVENTION

Many devices can benefit from optimization of space required forelectronic modules, which may allow miniaturization of the device itselfand/or introduction or enlargement of other device components. Compactelectronic modules are particularly useful for devices requiring volumeefficiency, including medical devices and consumer electronics devices.For instance, optimization of the packaging of an electronic module in atransistor radio would allow the entire radio to be more compact.Alternatively or additionally, the freed-up space could be used by othercomponents, such as a larger battery. As another example, the size ofimplantable medical devices is preferably minimized to reduce trauma,cosmetic, and other effects of a device located in the body.Optimization of the packaging of an electronic module in an implantablemedical device would allow the device to be smaller and/or allow thedevice to accommodate additional and/or larger components.

For example, implantable microstimulators known as Bion® devices arecharacterized by a small, cylindrical housing which contains electroniccircuitry that produces electric currents between spaced electrodes.These microstimulators are implanted proximate to target tissue, and thecurrents produced by the electrodes stimulate the tissue to reducesymptoms or otherwise provide therapy for various disorders. A compactelectronic module would allow a Bion device to be smaller and thuseasier to implant and less noticeable and/or allow the device toaccommodate additional and/or larger components, such as a largerrechargeable battery that would lengthen time between recharges.

Radio-frequency powered and battery powered microstimulators aredescribed in the art. See, for instance, U.S. Pat. No. 5,193,539(“Implantable Microstimulator); U.S. Pat. No. 5,193,540 (“Structure andMethod of Manufacture of an Implantable Microstimulator”); U.S. Pat. No.5,312,439 (“Implantable Device Having an Electrolytic StorageElectrode”); U.S. Pat. No. 6,185,452 (“Battery-Powered PatientImplantable Device”); U.S. Pat. No. 6,164,284 and U.S. Pat. No.6,208,894 (both titled “System of Implantable Device for Monitoringand/or Affecting Body Parameters”). The '539, '540, '439, '452, '284,and '894 patents are incorporated herein by reference in their entirety.

Microstimulators to prevent and/or treat various disorders are taught,e.g., in U.S. Pat. No. 6,061,596 (“Method for Conditioning PelvisMusculature Using an Implanted Microstimulator”); U.S. Pat. No.6,051,017 (“Implantable Microstimulator and Systems Employing theSame”); U.S. Pat. No. 6,175,764 (“Implantable Microstimulator System forProducing Repeatable Patterns of Electrical Stimulation”); U.S. Pat. No.6,181,965 (“Implantable Microstimulator System for Prevention ofDisorders”); U.S. Pat. No. 6,185,455 (“Methods of Reducing the Incidenceof Medical Complications Using Implantable Microstimulators”); and U.S.Pat. No. 6,214,032 (“System for Implanting a Microstimulator”). Thetechniques described in these additional patents, including powercharging techniques, may also be used with the present inventions. The'596, '017, '764, '965, '455, and '032 patents are incorporated hereinby reference in their entirety.

A number of the above cited patents describe microstimulator designs andmethods for manufacturing a microstimulator or portions of amicrostimulator. Disclosed herein are improved designs and techniquesfor producing compact electronic modules for a microstimulator or othermedical or non-medical device. In addition, the designs and methodsdisclosed allow such devices, to be manufactured more efficiently, morereliably, and/or more cost effectively.

BRIEF SUMMARY OF THE INVENTION

The present inventions address the above and other needs by providing,inter alia, improved methods for creating compact electronic modules.For instance, a present invention provides component and circuitrydesigns utilizing a redistribution technique that differ from standardredistribution processes, results, and uses. The technique creates aredistribution surface on the bare integrated circuit (IC) that allowssecondary components to be mounted above the IC and connectedelectrically to the IC through the redistribution surface. Theredistribution surface includes mounting pads and other interconnectionpads, some along the edge of the redistribution surface to allowsimplified connection to a substrate. A further improvement provideselectronic shielding within the redistribution surface.

The mounting pads may be positioned via the redistribution surface toone side of the IC, while a portion of the IC and the substrate on whichit is mounted are positioned between two halves of a ferrite core. Thelength and diameter of the ferrite core are thus maximized, whileproviding the IC and substrate space between the ferrite halves, as wellas beyond the ferrite core.

The halves of the ferrite core may further create a dumbbell shape,allowing the wire of the coil to be wound on the center,smaller-diameter portion of the core. The core shape facilitateswinding, centering, and protecting the coil, while maximizing the volumeof core material and diameter at the ends of the ferrite core. Thedumbbell shape further facilitates the creation of a cylindrical device,which is uniquely suited to some uses, such as implantation into a bodythrough a cannula, while also providing the above-stated results.

Methods and means for manufacturing/assembling components into compactelectronic modules is described herein. A carrier facilitatesmanufacturing, assembly, and testing of a small electronic device, andin particular, a small cylindrical device, which includes the compactelectronic modules of the invention. For instance, the carrier ensuresthe coaxial assembly of various components of a cylindrical package. Inaddition, the carrier protects and eases handling of the device.

Embodiments of the various inventions described herein may include someor all of the items mentioned above. Additional embodiments will beevident upon further review of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects of the present inventions will be moreapparent from the following more particular description thereof,presented in conjunction with the following drawings wherein:

FIG. 1A is a top view of a battery-powered Bion® device used to describethe inventions, showing exemplary dimensions for some components of thedevice;

FIG. 1B is a cross-sectional view taken along line 1B-1B of FIG. 1A;

FIG. 2A is an exploded view of the main internal components of thedevice;

FIG. 2B is a circuit diagram of the interactions of the main componentsof FIG. 2A;

FIG. 3 is a perspective top view of a substrate panel assembly;

FIG. 4A is a perspective top view of a substrate panel;

FIG. 4B is a perspective bottom view of the substrate panel of FIG. 4A;

FIG. 5 is a perspective top view of portions of the panel shown in FIG.3 with an integrated circuit chip attached;

FIG. 6A is an exploded view of one embodiment of layers formed whilemaking a unique redistributed surface on an integrated circuit;

FIG. 6B is a side view of an embodiment of a redistributed surface on anintegrated circuit;

FIG. 7A is a perspective top view of the panel assembly shown in FIG. 5with capacitors and diodes attached;

FIG. 7B is an enlarged detail view of some of the components shown inFIG. 7A;

FIG. 8A is a perspective top view of the panel assembly shown in FIG. 7Awith the top ferrite half attached;

FIG. 8B is an enlarged detail view of some of the components shown inFIG. 8A including wire bond electrical connections;

FIG. 9A is a isometric top view of a subassembly of the invention,including the wire bonds of FIG. 8B shown encapsulated with protectivematerial;

FIG. 9B is a plan view of the subassembly shown in FIG. 9A;

FIG. 10A is a isometric bottom view of the subassembly shown in FIG. 9A;

FIG. 10B is a plan view of the subassembly shown in FIG. 10A;

FIG. 11A is a perspective view of the subassembly shown in FIG. 9A witha coil wound on the middle section of the ferrite core;

FIG. 11B is a cross-section view of the subassembly shown in FIG. 11Ataken along line 11B-11B;

FIG. 11C is a bottom plan view of the subassembly shown in FIG. 11A withthe coil ends depicted;

FIG. 12 is an enlarged detail perspective view of the subassembly shownin FIG. 11C placed in a soldering fixture;

FIG. 13A is an exploded view of a carrier used during assembly;

FIG. 13B is a top view of the top carrier plate of FIG. 13A;

FIG. 13C is a bottom view of the bottom carrier plate of FIG. 13A;

FIG. 14 is a perspective view of a work-plate supporting the bottomcarrier plate of FIG. 13A, with the subassembly of FIG. 11A and astimulating capacitor placed in the bottom carrier plate;

FIG. 15 is a perspective view of a battery with connecting wires; and

FIG. 16 is a perspective view of the subassembly of FIGS. 11A-11C withthe battery of FIG. 15 and the stimulating capacitor of FIG. 14attached.

Corresponding reference characters indicate corresponding componentsthroughout the several views of the drawings.

DETAILED DESCRIPTION OF THE INVENTION

The following description is of the best mode presently contemplated forcarrying out the inventions. This description is not to be taken in alimiting sense, but is merely for the purpose of describing the generalprinciples of the inventions. The scope of the presently claimedinvention should be determined with reference to the claims.

As described above, the compact electronic modules and methods ofmanufacture as described and claimed may be used with numerous devices.Such modules and techniques are particularly useful in implantablemedical devices, as an example, and as such will be described inconjunction with such an implantable medical device. However, as will beunderstood by those of skill in the art of electronic devices, suchmodules and methods may be used with other types of devices.

The exemplary medical device that will be used herein to describe thesystems and methods of the inventions is a small, implantablestimulator, and more particularly a battery-powered microstimulatorknown as a Bion® microstimulator. For purposes of the presentdisclosure, the battery-powered Bion microstimulator will be referred toas device 10 or microstimulator 10.

The exemplary device 10 has a substantially cylindrical shape (whileother shapes are possible) and at least portions of it are hermeticallysealed. It includes a processor and other electronic circuitry thatallow it to generate stimulus pulses that are applied to a patientthrough electrodes in accordance with a program that may be stored, ifnecessary or desired, in programmable memory. The exemplary device 10also includes a rechargeable battery. The battery is recharged, asrequired, from an external battery charging system.

FIG. 1A is a top view of device 10 depicting exemplary overalldimensions for a case 12 and some internal components. As seen in FIG.1A, the device 10 includes case 12, electronic subassembly 14, powersource 16, active/stimulating electrode 22, and indifferent/referenceelectrode 24. The diagram of FIG. 1A is useful as a simplifiedrepresentation of the example device 10, depicting just a few of thedevice components. A cross-section of the assembled device 10 is shownin FIG. 1B. A better understanding of the designs, functions,interactions, and methods of manufacture of various components isprovided in the details that follow.

As mentioned above, the exemplary device used herein to describe theinventions is a substantially cylindrical medical device,microstimulator 10. In this exemplary configuration, case 12 has anouter diameter D1 of about 3.20 mm to about 3.30 mm. The inner diameterof the portion of case 12 enclosing electronic subassembly 14 is shownin FIG. 1A as D2. The inner diameter of the portion of case 12 enclosingbattery 16 is shown as D3. Inner diameter D2 is about 2.40 mm to about2.54 mm, and inner diameter D3 is about 2.92 mm to about 3.05 mm.

The length of case 12 plus stimulating electrode 22 is shown in FIG. 1Aas L1, and is about 27 mm. Length L2 of case 12 without electrode 22 isabout 24.5 mm. The portion of case 12 enclosing electronic subassembly14 is shown in FIG. 1A as length L3, and has a value of about 13.00 mm.The portion of case 12 enclosing battery 16 is shown in FIG. 1A aslength L4, which has a value of about 11.84 mm. Of course, these valuescan vary. For instance, L1 will change as the type of stimulatingelectrode 22 changes. As mentioned earlier, the fact that the assembliesand methods described and claimed herein may be used with small devicesis one of the advantages of the inventions, but it is in no waylimiting. The methods and systems described and claimed may be used witha multitude of devices of varying size and shape. To facilitateunderstanding of these methods and systems, some components of device 10and their manufacture/assembly are discussed in detail below.

As shown in FIG. 1A, device 10 includes a power source (e.g., arechargeable battery 16) and an electronic subassembly 14. Electronicsubassembly 14 contains circuitry and other components for, e.g.,stimulation, battery charging, telemetry, and production testing.Rechargeable battery 16 is a self-contained rechargeable battery, e.g.,a lithium-ion battery, which powers device 10. Battery 16 is recharged,as required, from an external battery charging system (not shown).

Device 10 contains an inductive coil 18 (shown in FIG. 1B) for receivingpower for battery charging and for telemetry. Coil 18 may also beutilized to implement additional functions, including voltageconversion/high voltage generation. In the present exemplaryconfiguration, coil 18 has an exemplary cylindrical shape and isconstructed from multiple turns of conductive wire wound around atwo-piece, dumbbell-shaped ferrite core. Assembly of coil 18 and thetwo-piece ferrite core, and other electronic components, will bediscussed in more detail presently.

Some internal components 200 of device 10 are shown unassembled in FIG.2A, and their interactions once assembled are depicted in the circuitdiagram of FIG. 2B. These components 200 include stimulating capacitor15; battery 16; substrate panel 202; integrated circuit (IC) 206;capacitors 208A1, 208A2, 208B1, and 208B2; diodes 210A and 210B; ferritehalves 212A and 212B; and unwound conductive coil wire 216. Assembly ofthese components is described below. Portions of the device and itsmanufacture/assembly are not detailed herein as they are not necessaryfor describing the inventions. Materials mentioned in the description ofthe manufacturing/assembly process are exemplary; other suitablematerials may be used.

As illustrated in FIG. 3, up to ten or more devices may be (but are notnecessarily) batch processed for at least a portion of themanufacture/assembly process. Batch processing allows the assemblyprocedures and testing to be more efficient than assembling each unitindividually. FIG. 3 shows substrate panel assembly 202 n, whichincludes substrate panels 202A, 202B, 202C, . . . through 202J, whichindividual panels are sometimes referred to herein as panel 202 orsubstrate 202. The contour of each panel 202 of substrate panel assembly202 n may be precut, with only small portions of the edges left attachedto substrate panel assembly 202 n. The small portions that are leftintact aid the alignment of other components and make futuresingularization of each panel 202 easier, even when other componentshave been assembled to panel assembly 202 n.

Substrate panel assembly 202 n is a single layer, double-sided,polyimide-copper circuit board, or other suitable flexible substratedesign/material(s). As is common in the art, mounting pads and traces onthe top and bottom of the panels (see FIGS. 4A and 4B, respectively) aregold-plated copper or the like and are electrically connected by viasthrough the panel material. The pads and traces on the top of substratepanels 202 are solderable and wire bondable. The pads on the bottom ofpanels 202 are solderable.

Substrate panel assembly 202 n may be identified by a serial numberprinted on a portion of the assembly during manufacturing of the panelassembly 202 n, while each panel 202 of substrate panel assembly 202 nmay be uniquely serialized, e.g., using a laser beam. For instance,metal pads 203C and 203D (shown in FIGS. 10B, and 11C),which are usedfor test probing during several steps of the assembly process, may carryeach unique panel serial number.

As seen, e.g., in FIGS. 1B, 5 and 10A, the top and bottom of substratepanel assembly 202 n are used to mount other components. As examples, anintegrated circuit 206 is mounted to the top 204 of each substrate panel202 and capacitor 208B1, 208B2 are mounted to the bottom 205 of eachsubstrate panel. All the off-chip, or secondary, components areelectrically connected to IC 206 through substrate 202 or throughredistributed surface 720, as described below.

Integrated circuit (IC) 206 is a custom designed IC chip (ASIC). The ICwafer includes a multitude of these custom ICs 206. The bare ICs 702 aremade using standard IC manufacturing processes. Wafer-level processingreduces production costs by allowing manufacturing and testing of largenumbers of ICs at one time. The IC wafer is then taken through apost-process called redistribution, which creates a redistributedsurface 720, an example of which is shown in FIGS. 6A and 6B, and asdescribed below:

-   -   a) Polyimide (or other suitable insulation) is deposited on the        top face 207 of the bare IC 702, if insulation is needed or        desired.    -   b) Photosensitive material such as photoresist is deposited on        top of the insulation.    -   c) The photosensitive material is exposed, e.g., through a mask,        in only selected areas (i.e., where the insulation is to remain        or is to be removed, depending on whether a “positive” or        “negative” process is used), as in photochemical etching        processes known in the art.    -   d) All of the photosensitive material and the portions of the        insulation that are not needed are removed, e.g., with a        chemical stripping solution. This leaves a first insulation        layer 704 where needed, but allows the interconnect pads        (aluminum or the like) on the top face 207 of the bare IC to        remain exposed.    -   e) Optionally, a layer of conductive material (e.g., copper) is        deposited as a grounding plane 706. When used, grounding plane        706 is ideally positioned between two layers of bond material        705 and 707, such as titanium tungsten. Photosensitive etching        or the like is used to remove these materials from around each        interconnect pad, leaving all but a ground pad isolated.    -   f) When grounding plane 706 is used, optional insulation layer        708, of polyimide or the like, is applied (via photochemical        etching or the like) to select areas, leaving exposed the        interconnect pads.    -   g) A bond layer 709 of titanium tungsten or the like is        deposited to aid the bonding of metal (e.g., copper)        redistribution layer 710, if needed or desired. Photosensitive        etching or the like may be used at this point, or later, as        described below.    -   h) A layer of copper or other conductive material is deposited.        This conductive material (aided by the surrounding layers)        creates the traces and mounting/interconnect/test pads, e.g.,        mounting pads 718 and interconnect pads 719/719A, of the        “redistribution” of redistribution layer 710 and redistribution        surface 720 that allow, e.g., secondary components such as        capacitors 208A1/208A2 and diodes 210A/210B to be assembled        above IC 206. This redistribution also simplifies        interconnections between IC 206 and substrate 202, as shown in        FIG. 12B. Photosensitive etching or the like may be used at this        point, or later, as described below.    -   i) Titanium tungsten or other suitable bonding material is        applied to redistribution layer 710 to create bond layer 711, if        needed or desired. Photosensitive etching or the like may be        used at each layer 709, 710, and 711 individually, or may be        used for two or all three of these layers at a time. As such,        the material of bond layers 709 and 711 may have the same        pattern as redistribution layer 710, or may cover more or less        than the redistribution layer material (such as only where two        metals overlap).    -   j) Insulation layer 714 of polyimide or the like is applied (via        photochemical etching or the like) to select areas, leaving some        conductive areas exposed, e.g., for mounting pads 718 on which        secondary components such as capacitors 208A1/208A2 and diodes        210A/210B will be placed.    -   k) A conductive layer 715 of gold or other conductive material        is applied (again, via photochemical etching or the like), if        needed or desired, to conductive areas, e.g., mounting pads 718        on which secondary components such as capacitors 208A1/208A2 and        diodes 210A/210B will be placed, so may thus be part of a        surface layer 716. Conductive layer 715 is preferably (but not        necessarily) about 8-10 microns thick when complete, while the        other layers of redistributed surface 720 are preferably about        4-5 microns when complete.

-   Depending on the above described options that are used, various    “layers”, e.g., parts of redistribution layer 710, insulation layer    714, parts of conductive layer 715, may form surface layer 716.

This redistribution process, the resulting redistributed surface 720,and use thereof differ from standard redistribution processes, results,and uses. In standard use, redistribution is used to route connectionsfrom peripheral pads into a ball grid array or other area array patternof “under bump metallurgy” balls that allows the chip to be, forinstance, “flipped” onto a printed wire board or other substrate havingmatching interconnects. The unique redistribution process of the presentinvention forms a custom-designed layout resulting in a number ofmounting pads 718 on which off-chip secondary components are directlymounted, as well as a number of test and interconnect pads 719/719A,some of which are routed to the periphery of the IC.

The resulting configuration of IC 206 (i.e., with redistributed surface720), substrate 202, and secondary, off-chip components has a number ofadvantages. Bare IC 702 includes all circuitry that would ordinarily beincluded or desired in the IC, with no added requirements or detrimentaleffect to the IC. For instance, bare IC 702 is not constrained byrequiring mounting pads in particular positions on the bare IC top face207 (and/or the packaging is not constrained by having surface mountedcomponents positioned where most convenient for the IC design). Theredistributed surface 720 on bare IC 702 contains substrate-likemounting pads 718 above the top face 207 of bare IC 702, whichaccommodate secondary components that typically require large mountingpads for attachment. This redistributed surface 720 contains larger,more reliable traces than would traces in the IC, allowing more reliablerouting to more conveniently placed, more durable, and larger mountingpads 718 than interconnection pads on the top face 207 of the “bare” IC702. Since the secondary components mounted on redistributed surface 720would normally use significant substrate surface area, the size andcomplexity of substrate 202 is minimized, which in turn minimizes thesize of the device containing substrate 202 (or frees up space for othercomponents).

Also, the number of connections between the IC and substrate is reducedor eliminated. Connections between off-chip components and the substrateare also reduced since off-chip components mounted to the redistributedsurface 720 are thereby connected electrically to the IC, rather thanbeing electrically connected by wire bonding through the substrate, asare components surface mounted to some “bare” ICs. Surface mountingcomponents to the redistributed surface 720, rather than directly to the“bare” IC is also more reliable. For instance, mechanical stress onsolder joints between a “bare” IC and a traditionally surface mountedcomponent, induced by a thermal mismatch between the IC and thecomponent, is alleviated.

Additionally, the ICs may be batch processed, as may placing componentson the ICs, leading to increased efficiency, yield, and/or cost savings.In addition, this arrangement facilitates use of traditional, low-cost,reliable chip-and-wire technology for IC-to-substrate and secondarycomponent-to-substrate connections.

Furthermore, space above a bare IC 702 that would ordinarily be unusedis occupied by components that would otherwise increase the size of thedevice. The added layers on bare IC top face 207 also provide a dampingmedia for protection against the stresses and damages caused by assemblyhandling and component placement. The IC and substrate being of similarlength also increases the mechanical strength of the subassembly, which,e.g., increases yield through production processing.

The optional grounding plane 706 provides electronic shielding forsensitive components within IC 206, when needed. Since theredistribution brings interconnected circuits and components into closeproximity, noise signals and voltage levels from the secondarycomponents may potentially affect circuits within IC 206. Groundingplane 706, connected to a grounding pad (but not connected to any otherinterconnect pads), provides an isolated and quiet environment forelectronics in IC 206.

Insulation layer 714 may potentially be created after secondarycomponent(s) are mounted to mounting pad(s) 718. For instance, anon-conductive epoxy or the like may be used to encapsulate the bottomportion of a secondary component and surrounding areas where insulationis desired, such as on traces formed during creation of redistributedsurface 720.

Using the top 204 of the substrate assembly 202 n or each substratepanel 202, a non-conductive adhesive such as non-conductive epoxy isapplied to attach each integrated circuit 206 as shown in FIG. 5. Afterthe ICs 206 are assembled to substrate panels 202, each non-serializedIC 206 is uniquely identified by the serial number on substrates 202,and can be tested and calibrated with calibration information savedtogether with the serial number. For instance, test pads 719A (and/orpads 718, 719) may be used for testing at this point, as they may alsohave been used for testing of the ICs at wafer level. However, once theICs are assembled to substrates, the calibration and test results may besaved with the respective serial numbers.

Conductive epoxy or the like is used to attach off-chip components,e.g., capacitors 208A1, 208A2 and diodes 210A, 210B, to mounting pads718 on the redistributed surface 720 of each IC 206, as shown in FIGS.7A and 7B. As seen in FIG. 8A and in enlarged view in FIG. 8B,conductive wires 214, such as gold wires, electrically connectcomponents (e.g., capacitors 208B1, 208B2) through the substrate to theIC. Wires 214 are attached to traces on the substrate top 204 and topads 719 on the IC redistributed surface 720 via wire bonding.Similarly, wires 214A, such as gold wires, connecting traces onsubstrate top 204 to diodes 210A and 210B (which are alreadyelectrically connected to IC 206 through mounting pads 718 andredistribution surface 720) are attached via wire bonding.

Quality inspection and testing (e.g., using test pads 719A) aretypically performed at this point, as well as at other points in themanufacturing process. To protect wires 214, 214A from damage that mayoccur during the assembly and handling, the wires may be encapsulated,e.g., with an epoxy (such as Hysol®, available from Loctite of RockyHill, Conn.) or other non-conductive material 217, as shown in FIGS. 9Aand 9B.

As seen, e.g., in FIGS. 1B, 9A, 1A, and 11B, ferrite half cylinders 212Aand 212B “sandwich” a portion of panel 202 and a portion of associatedintegrated circuit 206. This design maximizes the length of ferrite (orother suitable core material) half cylinders 212A and 212B and diameterof the resulting ferrite core and coil 18, thus maximizing the magneticinductance of the coil assembly. At the same time, since the ferritehalves “sandwich” IC 206 and substrate 202, the length of the housing isless than if these components were arranged in series. The sandwichdesign protects the IC and substrate while increasing the mechanicalstrength of the assembly. In addition, positioning IC 206 and substrate202 between the ferrite halves allows the size of the IC (and substrate)to be maximized without lengthening the electronic subassembly 14 (andthus the device). Furthermore, the length of IC 206 (and substrate 202)is not limited to the length of the ferrite core; IC 206 can extendnearly the full length of electronic subassembly 14, allowing mountingof secondary components above IC 206 via redistributed surface 720.

By extending IC 206 through and beyond the ferrite core, it is possibleto use a “one-chip” approach, thus avoiding the difficulties ofprocessing two ICs. It is possible to use a two-IC approach, forinstance, using flip-chip technology. However, using two chipspotentially increases the number of interconnects, the size of thesubassembly, and the difficulties of processing the subassembly. Forinstance, under-fill reinforcement may be difficult, while processingwithout under-fill reinforcement requires more placement accuracy, whichmay decrease efficiency, e.g., due to piece processing rather than batchprocessing.

In addition, as can be seen in the figures, core halves 212A and 212Bform a core having a “dumbbell” shape. This shape further increases coilinductance by maximizing the ferrite material and diameter at the endsof the ferrite core. In addition, the dumbbell shape aids in the windingof wire 216 into coil 18 by acting as a mandrel, by constraining thewire to fit in the middle section of the dumbbell shape, and bycentering the winding along the ferrite core. The dumbbell shape alsohelps to protect the wire of coil 18 during subsequent assembly steps.In addition, having a dumbbell shaped core achieves these goals whilealso facilitating creation of a cylindrically shaped device, which isthe most efficient shape for some uses. For instance, a cylindricallyshaped microstimulator 10 is ideally suited for insertion into a bodythrough a cannula.

Non-conductive epoxy or other appropriate non-conductive adhesive isapplied to bond top ferrite half 212A to a portion of IC redistributedsurface 720, as shown in FIGS. 8A, 9A, and 9B. Similarly, non-conductiveepoxy or the like is applied to bond bottom ferrite half 212B to aportion of substrate bottom 205, as shown in FIGS. 10A and 10B.Alternatively, the coil may hold the ferrite halves in place, so no orlittle adhesive material need be used.

Conductive adhesive such as conductive epoxy is applied to bond andelectrically connect capacitors 208B1 and 208B2 to substrate mountingpads 730 (FIG. 4B) on the substrate bottom 205, as shown in FIGS. 10Aand 10B. At this point in the assembly/manufacture process, partiallyassembled units 200A are typically separated from panel assembly 202 n,e.g., by breaking away the pre-cut small portions made to contour theedge of each panel 202. Of course, panels 202 may be separated frompanel assembly 202 n by any useful means and at any useful point inassembly/manufacture.

FIGS. 9B and 10B show pads 203A, 203B, 203C, and 203D protruding fromone end of the ferrite “sandwich” arrangement. Pads 203A and 203B areused to connect stimulating capacitor 15, as described below, and canalso be used for testing. As described earlier, pads 203C and 203D carrythe serial number and are also used for electrical test probing.(Connector pads 201A, 201B, 201C, and 201D (FIGS. 10A and 10B) may alsobe used for testing.) Also seen in FIGS. 10A and 10B is mark 221 (shownon capacitor 208B, but it may be placed wherever practical) which aidsin orientation and handling during manufacturing.

The unwound coil wire 216, made of 46 gauge insulated magnetic copperwire or other suitable conductive wire material, is wound on the middlesection of the ferrite halves 212A and 212B (see FIGS. 11A and 11B). Thecoil wire 216 in a wound configuration is referred to as coil 18, asshown, e.g, in FIGS. 1B, 11A, and 11B. Coil 18 may have, for instance,156 turns in two layers, identified in FIG. 11B as coil layer 223A andcoil layer 223B. One coil layer or more than two coil layers may insteadbe used, as may a different number of turns in the winding. The numberof turns and layers, and other design elements of the coil assembly,depend on the requirements of the coil assembly, such as frequency,current, and voltage. As shown in FIG. 11B and discussed earlier, anexemplary “dumbbell” configuration is formed with the arrangement of thetwo core halves 212A and 212B in which the gap formed by the distances Aand B is used to wind coil 216. This configuration maximizes the size ofthe core and the coil (and IC 206 and substrate 202, as describedearlier) in the constrained space of case 12, and aids in manufacturing.

A soldering fixture 226, shown in FIG. 12, may be used to assist interminating the coil 18 ends 228A and 228B to pads 201A and 201B ofpanel 202 (FIG. 11C). Soldering coil ends 228A and 228B becomes morepractical when the subassembly 200B is isolated and secured usingsoldering fixture 226 or other suitable fixture. Subassembly 200B isplaced in fixture 226 with the bottom of panel 202 facing up, asidentified by mark 221 or other orientation marker, and is held firmlyin place, for instance, by handle 226A which is tightened by bolt 226B.FIG. 12 shows subassembly 200B securely loaded in soldering fixture 226.The two coil ends 228A and 228B are soldered or similarly connected topads 201A and 201B, respectively. Tinning of pads 201C and 201D may alsobe performed at this time, and subassembly 200B may be baked prior tobattery 16 attachment.

A carrier 230, such as shown in FIG. 13A, can be used to facilitatefurther assembly processes by, for instance, aiding inconcentric/coaxial alignment of components, serving as a dimensionalcontrol gauge, easing handling by effectively increasing the size of thedevice being handled, providing protection for sensitive components,allowing stacking of devices (e.g., within carriers during processing,baking, temperature cycling or other testing), and/or providing accessfor testing during various stages of assembly. Carrier 230 may be madeof conductive or dissipative polyetherimide (such as Ultem®, availablefrom GE Plastics of Pittsfield, Mass.), or other material to limitElectrical Static Discharge (ESD).

Carrier 230 may comprise two plates: top plate 230A (FIGS. 13A and 13B)and bottom plate 230B (FIGS. 13A and 13C). Cavities 231A, 231B, and 231C(FIG. 13A) securely hold the partially assembled device when plates 230Aand 230B are bolted (or otherwise coupled) together. Top plate 230Acontains openings 232A and 232B and bottom plate 230B contains openings232C and 232D to allow access to the device components for assembly,testing, and inspection. Plates 230A and 230B are securely fastened,e.g., with bolts 234A and 234B that align with holes 233A and 233B (FIG.13A). If desired, carrier 230 (or bottom plate 230B) may be aligned andsecured to a work plate 239 via holes 233C and 233D in carrier 230 andpins 237A and 237B on work plate 239 (see FIG. 14), or other suitablemethod. Having the carrier 230 aligned and secured to a work plate 239may further facilitate portions of the assembly process.

Subassembly 200B and stimulating capacitor 15 are placed in carrierbottom plate 230B as shown in FIG. 14, then top plate 230A is secured tobottom plate 230B, e.g., with bolts 234A and 234B. Stimulating capacitor15 may be a tantalum capacitor, for instance, in which case it wouldpreferably include a gold-plated nickel ribbon attached via resistancewelding or the like to a tantalum pin protruding from one end ofcapacitor 15, as shown in FIG. 2A. If, as another example, a ceramiccapacitor 15 is used, a ribbon would not be needed. Instead, a wire ofstainless steel, nickel, copper, solder coated copper, or the like,protruding from one end of capacitor 15 may simply be bent to one sidefor attachment to pad(s) 203A/203B.

The type of stimulating capacitor 15 used may depend on the intended useof microstimulator 10. For instance, a tantalum capacitor may have acapacitance of approximately 7 microfarads, while a ceramic capacitormay have a capacitance of approximately 3 microfarads. The capacitorbest suited to the requirements of the device in a given setting maythus be chosen. In any case, stimulating capacitor 15 is preferably aright circular cylinder that fits snugly within case 12.

Through opening 232A on top plate 230A, testing at pads 203A/203B (whichare electrically connected) may be accomplished, then solder, conductiveepoxy, or other suitable conductive adhesive 229 is applied (or othersuitable method is used) to bond the ribbon or wire (or the like) ofstimulating capacitor 15 to pad 203A and/or 203B. A material such as UVor thermal curable non-conductive epoxy 229A or the like may also beapplied to reinforce the connection (see FIG. 16). Optionally, one or aportion of one of pads 203A/203B is left exposed for further testing. Atthis point, as at various points throughout the manufacturing process,the assembly is tested and processed through burn-in, baking, andtemperature cycling while in carrier 230. For instance, opening 232C maybe used to test at pads 201A, 201B, 201C, and/or 201D. Openings 232D maybe used to test at pads 203C and 203D, and stimulating capacitor 15.

If battery 16 was not previously placed in the carrier, top carrierplate 230A is removed, battery 16 is placed in cavity 231C of bottomplate 230B, and top plate 230A is fastened back in place. Battery 16,shown in FIG. 15, has a cathode (negative polarity) shell 70 and ananode (positive polarity) center pin 95 that protrudes, e.g., 0.25 mmfrom one end. Shell may be made of titanium, stainless steel, or othersuitable cathodic material, while pin 95 may be made of platinum,molybdenum or other suitable anodic material. Two wires 68A and 68B madeof nickel or the like are used for connecting battery 16 to electronicsubassembly 14. Wire 68A is insulated (to prevent shorting) and laserwelded or otherwise electrically connected to pin 95, and wire or ribbon68B (insulated or not) is laser welded or otherwise electricallyconnected to the case of the battery.

Battery 16 is placed into cavity 231C so the long ends of wires 68A and68B are pointing downwards (towards bottom plate 230B and bottom 205 ofpanel 202). Using opening 232B through top plate 230A, UV curablenon-conductive epoxy 219 or the like is applied to reinforce theconnection of the wires to the battery, while leaving the long ends ofthe wires 68A and 68B free. Carrier 230 is turned over so the free endsof wires 68A and 68B are accessible via opening 232C in bottom plate230B. The free ends of wires 68A and 68B are trimmed, if necessary, andbent towards substrate 202. The free end of wire 68A is soldered tosubstrate pad 201D and the free end of wire 68B is soldered to substratepad 201C. To complete subassembly 200C, as shown in FIG. 16, additionalnon-conductive epoxy 219 or the like may be applied to further securethe connection of wire 68A soldered to pad 201D and wire 68B soldered topad 201C.

Once assembly 200C is complete, components 200 are contained within,e.g., housing 12 consisting of two cylindrical shells 213 and 215, asbest seen in the cross sectional view of FIG. 1B. A variety of materialsand shapes may be used for the housing. Via electrical attachment tostimulating capacitor 15, electrode 22 becomes the active or stimulatingelectrode. Shell 213 is electrically attached to the cathodic surface ofbattery 16, and a portion thereof may be formed, coated, plated, orotherwise processed with suitable material(s) to become the indifferentelectrode 24, as shown in FIG. 1B. The device may be further processedwith one or more coatings, or other post-assembly processes.

While the inventions herein disclosed have been described by means ofspecific embodiments and applications thereof, numerous modificationsand variations could be made thereto by those skilled in the art withoutdeparting from the scope of the invention set forth in the claims. Forinstance, a number of the assembly/manufacturing procedures describedmay be performed in a different sequence than detailed herein. Somesequences were presented in an order most conducive to describing thegeneral principles of the inventions, and should not be construed aslimiting. Variations are within the scope of the inventions, as definedby the various claims.

1. An electronic module, comprising: an integrated circuit containingcomponents comprising a portion of an electronic circuit; aredistributed surface formed on the integrated circuit, including atleast one redistribution layer above at least some portions of a topface of the integrated circuit, which redistribution layer iselectrically connected to the integrated circuit and includes at leastone conductive trace, at least one mounting pad, and a plurality ofinterconnect pads, which interconnect pads are positioned along at leastone edge of the redistributed surface by the conductive traces; a layerof insulation above at least some portions of the redistribution layer;at least one secondary component mounted to the at least one mountingpad and electrically connected to the integrated circuit via theredistributed surface; a substrate including electrical traces of theelectronic circuit, wherein a plurality of the electrical tracesterminate along at least one edge of the substrate; and wire bondsconnecting at least one of the interconnect pads along at least one edgeof the redistributed surface and at least one of the electrical tracesalong at least one edge of the substrate.
 2. The electronic module ofclaim 1 wherein the at least one secondary component is at least one ofa diode, a capacitor, a power source, and a coil.
 3. The electronicmodule of claim 2 further comprising additional components electricallyconnected to the integrated circuit to form a microstimulatorelectronics package.
 4. The electronic module of claim 1 furthercomprising a coil comprising a winding around a core; the corecomprising two separate halves; one core half secured to a portion ofthe redistributed surface of the integrated circuit; and a second corehalf secured to a portion of the substrate.
 5. The electronic module ofclaim 4 wherein the core, when the two halves are assembled, is adumbbell shape.
 6. The electronic module of claim 4 wherein the at leastone mounting pad is positioned at one end of the redistributed surface.7. The electronic module of claim 1 further comprising a substrateincluding electrical traces of the electronic circuit, wherein at leastone electrical trace terminates along at least one edge of thesubstrate, and at least one wire bond connecting the at least onesecondary component mounted to the at least one mounting pad and the atleast one electrical trace along at least one edge of the substrate. 8.The electronic module of claim 1 wherein the redistributed surfacecomprises at least one of copper, polyimide, gold, and titaniumtungsten.
 9. The electronic module of claim 1 further comprising a firstlayer of insulation on at least some portions of the top face of theintegrated circuit.
 10. The electronic module of claim 9 wherein theredistribution layer includes: a first layer of bond material on atleast some portions of the integrated circuit; a layer of conductiveredistribution material on at least portions of the first bond layer;and a second layer of bond material on at least some portions of theredistribution material.
 11. The electronic module of claim 10 whereinthe first bond layer covers portions of the integrated circuit andportions of the first insulation layer, and wherein the conductiveredistribution material covers the first bond layer, and wherein thesecond bond layer covers the redistribution material.
 12. The electronicmodule of claim 9 further comprising: a grounding layer comprising atleast a layer of shielding material above at least some portions of theintegrated circuit.
 13. The electronic module of claim 12 wherein thegrounding layer includes: a first layer of grounding bond material on atleast some portions of the integrated circuit; a layer of shieldingmaterial on at least some portions of the first grounding bond layer;and a second layer of grounding bond material on at least some portionsof the shielding material.
 14. The electronic module of claim 13 whereinthe first layer of grounding bond material covers portions of theintegrated circuit and portions of the first insulation layer, andwherein the layer of shielding material covers the first grounding bondlayer, and wherein the second grounding bond layer covers the layer ofshielding material.
 15. An electronic module, comprising: an integratedcircuit including a top face and a bottom face and containing componentscomprising a portion of an electronic circuit; a redistributed surfaceformed on the top face of the integrated circuit, including at least oneredistribution layer comprising at least a layer of conductiveredistribution material above at least some portions of the top face ofthe integrated circuit, which redistribution layer is electricallyconnected to the integrated circuit and includes at least one conductivetrace, at least one mounting pad, and a plurality of interconnect pads,which interconnect pads are positioned via the conductive traces alongat least one edge of the redistributed surface; and a layer ofinsulation above at least some portions of the redistribution layer; atleast one secondary component mounted to the at least one mounting padand electrically connected to the integrated circuit via theredistributed surface; a substrate including electrical traces of theelectronic circuit, wherein a plurality of the electrical tracesterminate along at least one edge of the substrate; and wire bondsconnecting at least one of the interconnect pads along at least one edgeof the redistributed surface and at least one of the electrical tracesalong at least one edge of the substrate.
 16. The electronic module ofclaim 15 further comprising a first layer of insulation on at least someportions of the top face of the integrated circuit.
 17. The electronicmodule of claim 16 wherein the redistribution layer includes: a firstlayer of bond material on at least some portions of the integratedcircuit; a layer of conductive redistribution material on at leastportions of the first bond layer; and a second layer of bond material onat least some portions of the redistribution material.
 18. Theelectronic module of claim 17 wherein the first bond layer coversportions of the integrated circuit and portions of the first insulationlayer, and wherein the conductive redistribution material covers thefirst bond layer, and wherein the second bond layer covers theredistribution material.
 19. The electronic module of claim 16 furthercomprising: a grounding layer comprising at least a layer of shieldingmaterial above at least some portions of the integrated circuit.
 20. Theelectronic module of claim 19 wherein the grounding layer includes: afirst layer of grounding bond material on at least some portions of theintegrated circuit; a layer of shielding material on at least someportions of the first grounding bond layer; and a second layer ofgrounding bond material on at least some portions of the shieldingmaterial.
 21. The electronic module of claim 20 wherein the first layerof grounding bond material covers portions of the integrated circuit andportions of the first insulation layer, and wherein the layer ofshielding material covers the first grounding bond layer, and whereinthe second grounding bond layer covers the layer of shielding material.22. An electronic module, comprising: an integrated circuit including atop face and a bottom face and containing components comprising aportion of an electronic circuit; a first layer of insulation on atleast some portions of the top face of the integrated circuit; aredistributed surface formed on the top face of the integrated circuit,including at least one redistribution layer comprising at least a layerof conductive redistribution material above at least some portions ofthe top face of the integrated circuit, which redistribution layer iselectrically connected to the integrated circuit and includes at leastone conductive trace, at least one mounting pad, and a plurality ofinterconnect pads, which interconnect pads are positioned via theconductive traces along at least one edge of the redistributed surface;and a layer of insulation above at least some portions of theredistribution layer; at least one secondary component mounted to the atleast one mounting pad and electrically connected to the integratedcircuit via the redistributed surface; a substrate including electricaltraces of the electronic circuit, wherein a plurality of the electricaltraces terminate along at least one edge of the substrate; and wirebonds connecting at least one of the interconnect pads along at leastone edge of the redistributed surface and at least one of the electricaltraces along at least one edge of the substrate.